With the rapid progress in laser technology the demands for higher precision of laser based applications like cutting, welding, drilling and ablation arose. With the realization of industrial grade ultrashort pulsed (USP) lasers the field of micromachining, meaning precision in the (sub-)micrometer range, was entered. USP lasers deliver pulses with durations of several picoseconds down to some hundreds of femtoseconds. These short pulse durations lead to ultra-high peak powers with modest average power. Thus the material is evaporated directly without entering the liquid phase enabling non-thermal processing. Hence detrimental effects like melting of the surrounding material or the generation of micro-cracks are avoided. This even enables the processing of very brittle or heat-sensitive materials.
For a complete system a 2-axis-galvo with controller and software as well as optic components for collimating and focusing the beam are needed.
In the matrix below all components needed beside the laser source are shown.
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